Descripción general: TT Electronics es un proveedor global de ingeniería electrónica. Colaboramos con nuestros clientes de los mercados de transporte, industrial, médico, defensa y aeroespacial proporcionándoles soporte técnico y nuestra experiencia a través de una red global de especialistas e instalaciones de clase mundial. Con aproximadamente 6000 colegas operamos desde 27 lugares alrededor del mundo. Construir la experiencia de nuestra gente es fundamental para el éxito futuro de nuestra organización. Ven y trabaja con nosotros “a la manera de TT”, que significa hacer lo correcto, sacar lo mejor de uno, lograr más trabajando juntos, demostrar nuestra experiencia y hacer las cosas...bien! Como empleador responsable alentamos a nuestra gente a "devolver algo" apoyando a las comunidades locales donde operamos. Responsabilidades: **Introduction** The Industrialization Engineer is responsible for leading the transition of new products and processes from R\&D to full\-scale manufacturing, ensuring robust, efficient, and cost\-effective production. The ideal candidate will have hands\-on experience in **semiconductor or optoelectronic packaging**, particularly **surface mount technology (SMT)** and related assembly processes. This role bridges product design and production, focusing on manufacturability, process optimization, and yield improvement. **Key Responsibilities*** **New Product Industrialization** * + Lead the industrialization of new semiconductor or optoelectronic devices, from prototype through mass production. + Collaborate with R\&D, design, and production teams to ensure manufacturability and process stability. + Develop and qualify new manufacturing processes, materials, and equipment. * **Process Development \& Optimization** * + Define, document, and optimize assembly and packaging processes (e.g., die attach, wire bonding, flip\-chip, reflow soldering, underfill, optical alignment). + Implement process control methods (SPC, DOE, FMEA) to enhance yield and reliability. + Analyze production data to identify root causes of process variation and drive corrective actions. * **Equipment \& Tooling** * + Specify and validate production equipment and tooling for SMT and packaging lines. + Work with equipment suppliers to develop process parameters and acceptance criteria. + Support line ramp\-up and maintenance of stable operations. * **Documentation \& Standards** * + Generate and maintain process documentation including work instructions, control plans, and PFMEAs. + Support the implementation of Lean Manufacturing and continuous improvement methodologies. * **Cross\-Functional Collaboration** * + Partner with Quality, Supply Chain, and Product Engineering to resolve technical issues and meet production targets. + Interface with external partners and subcontractors for process transfer or outsourcing activities. Cualificaciones: **Qualifications** **Education:*** Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, or a related field. * **Experience:** + 3\+ years of experience in **semiconductor assembly, optoelectronic packaging**, or **SMT manufacturing** environments. + Proven experience in **new product introduction (NPI)** and **process qualification** (IQ/OQ/PQ). + Familiarity with **cleanroom operations**, **microscale assembly**, and **reliability testing** is preferred.**Technical Skills:** + Knowledge of SMT processes (solder paste printing, placement, reflow) and optical component packaging. + Experience with process simulation, statistical analysis (Minitab, JMP), and design of experiments (DOE). + Understanding of industry standards such as **JEDEC**, **IPC**, and **MIL\-STD** for electronics packaging.**Soft Skills:** + Strong problem\-solving, analytical, and documentation skills. + Excellent communication and cross\-functional teamwork abilities. + Ability to manage multiple projects in a fast\-paced, technical environment. :