Overview: TT Electronics is a global provider of electronic engineering solutions. We collaborate with our customers in the transportation, industrial, medical, defense, and aerospace markets by delivering technical support and leveraging our expertise through a global network of specialists and world-class facilities. With approximately 6,000 colleagues, we operate from 27 locations worldwide. Building the expertise of our people is fundamental to the future success of our organization. Join us and work “the TT way” — doing the right thing, bringing out the best in ourselves, achieving more by working together, demonstrating our expertise, and getting things done…right! As a responsible employer, we encourage our people to “give back” by supporting local communities where we operate. Responsibilities: **Introduction** The Industrialization Engineer is responsible for leading the transition of new products and processes from R\&D to full-scale manufacturing, ensuring robust, efficient, and cost-effective production. The ideal candidate will have hands-on experience in **semiconductor or optoelectronic packaging**, particularly **surface mount technology (SMT)** and related assembly processes. This role bridges product design and production, focusing on manufacturability, process optimization, and yield improvement. **Key Responsibilities** * **New Product Industrialization** * + Lead the industrialization of new semiconductor or optoelectronic devices, from prototype through mass production. + Collaborate with R\&D, design, and production teams to ensure manufacturability and process stability. + Develop and qualify new manufacturing processes, materials, and equipment. * **Process Development \& Optimization** * + Define, document, and optimize assembly and packaging processes (e.g., die attach, wire bonding, flip-chip, reflow soldering, underfill, optical alignment). + Implement process control methods (SPC, DOE, FMEA) to enhance yield and reliability. + Analyze production data to identify root causes of process variation and drive corrective actions. * **Equipment \& Tooling** * + Specify and validate production equipment and tooling for SMT and packaging lines. + Work with equipment suppliers to develop process parameters and acceptance criteria. + Support line ramp-up and maintenance of stable operations. * **Documentation \& Standards** * + Generate and maintain process documentation including work instructions, control plans, and PFMEAs. + Support the implementation of Lean Manufacturing and continuous improvement methodologies. * **Cross-Functional Collaboration** * + Partner with Quality, Supply Chain, and Product Engineering to resolve technical issues and meet production targets. + Interface with external partners and subcontractors for process transfer or outsourcing activities. Qualifications: **Qualifications** **Education:** * Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, or a related field. * **Experience:** + 3+ years of experience in **semiconductor assembly, optoelectronic packaging**, or **SMT manufacturing** environments. + Proven experience in **new product introduction (NPI)** and **process qualification** (IQ/OQ/PQ). + Familiarity with **cleanroom operations**, **microscale assembly**, and **reliability testing** is preferred. **Technical Skills:** + Knowledge of SMT processes (solder paste printing, placement, reflow) and optical component packaging. + Experience with process simulation, statistical analysis (Minitab, JMP), and design of experiments (DOE). + Understanding of industry standards such as **JEDEC**, **IPC**, and **MIL-STD** for electronics packaging. **Soft Skills:** + Strong problem-solving, analytical, and documentation skills. + Excellent communication and cross-functional teamwork abilities. + Ability to manage multiple projects in a fast-paced, technical environment. :