




As a leading technology innovator, we push the boundaries of what's possible and drive transformation in communication and data processing to help create a smarter, connected future for all. In this journey, we are evolving into an “AI\-first” intelligent\-edge powerhouse, combining high\-performance, low\-power compute and seamless connectivity while pushing intelligence closer to users through ultra\-efficient, on\-device AI that ensures privacy, personalization, and real\-time responsiveness. This is the Invention Age—and this is where you come in. **Key Responsibilities:** * Work with system architecture and SoC design teams, define and assess 3DIC process technology requirements and roadmap * PPAC assessment for System\-Technology Co\-Optimization (STCO) for new product development * Foundry interface for 3DIC physical design flow and key design rule definitions * Establish dependency of 3D process solutions on key chip architecture and design KPI and co\-optimize 3D solutions accordingly. * Pathfinding and development of chiplet physical design methodology and PDK development * 3D DRAM and Cache SRAM Architecture evaluation for AI and other Compute workloads * Custom DRAM integration technology evaluation and pathfinding **Desired Skillset/Experience:** * Experience with 2\.5D and 3D STCO and pathfinding * 2\.5 and 3D Chip partition and dependencies on Product KPI like performance, power, chip and beachfront area, chip\-chip communication metrics, power grid etc. * System and/or chip\-level architecture and physical design experience for 3D cache partitioning (a plus) * Physical design experience with SoIC and/or CoWoS * Experience with 2\.5D/3D IC design flow and PDK development * Familiarity with heterogeneous integration processes such as hybrid bonding, wafer bonding, TSV, backside metallization * Process development and/or system and product development experience with advanced technology (sub 4nm) and its PPAC assessment * Custom layout, svrf, scripting skills * Hands\-on experience with DRC, LVS, PEX (a plus) **Additional Qualifications:** * Ability to work across teams and BUs * Ability to work without supervision and as part of a team * Most tasks do not have defined steps; simultaneous use of multiple mental abilities is generally required to determine the best approach * Advanced data analysis and interpretation skills are required. **Minimum Qualifications** Bachelor's degree in Science, Engineering, or related field and 5\+ years of AI relevant System and technology or related work experience. OR Master's degree in Science, Engineering, or related field and 4\+ years of AI relevant System and technology or related work experience. OR PhD in Science, Engineering, or related field and 3\+ years of AI relevant System and technology or related work experience.


