Summary: The Industrialization Engineer leads the transition of new products from R&D to manufacturing, focusing on efficiency, cost-effectiveness, and process optimization. Highlights: 1. Lead industrialization of new semiconductor/optoelectronic devices 2. Optimize assembly and packaging processes using SPC, DOE, FMEA 3. Collaborate across R&D, design, and production teams Company Overview: At TT Electronics, you will meet dedicated people who believe that advanced electronics is the key to a brighter, smarter future. Whether it’s advanced flight controls, smart surgical tools, intelligent vehicle charging or seamless automation everywhere, advancements like this come from the minds of passionate, creative people – working to a common goal, watching out for each other, and caring about making a difference in the lives of people all over the world. Our passion? Simplifying the development of complex electronics… it’s the reason we exist as an organisation. Our way of life? Fostering a culture that values individuals as well as community and teamwork. Join us – and work with a team that believes success is measured by more than the bottom line, where you’ll find opportunities to achieve your goals, contribute to the lives of others, and build a brighter, smarter future, together. TT Electronics’ Mexicali facility houses 65,000 square feet of office and advanced manufacturing. With a large workforce of 126 employees, this site operates in multiple shifts with cellular production lines and 13 production cells. This site is ISO9001 certified and manufactures an array of technologies including variable and fixed resistors, EPS sensors, and trimmers. Role Overview and Responsibilities: **Introduction** The Industrialization Engineer is responsible for leading the transition of new products and processes from R\&D to full\-scale manufacturing, ensuring robust, efficient, and cost\-effective production. The ideal candidate will have hands\-on experience in **semiconductor or optoelectronic packaging**, particularly **surface mount technology (SMT)** and related assembly processes. This role bridges product design and production, focusing on manufacturability, process optimization, and yield improvement. **Key Responsibilities*** **New Product Industrialization** * + Lead the industrialization of new semiconductor or optoelectronic devices, from prototype through mass production. + Collaborate with R\&D, design, and production teams to ensure manufacturability and process stability. + Develop and qualify new manufacturing processes, materials, and equipment. * **Process Development \& Optimization** * + Define, document, and optimize assembly and packaging processes (e.g., die attach, wire bonding, flip\-chip, reflow soldering, underfill, optical alignment). + Implement process control methods (SPC, DOE, FMEA) to enhance yield and reliability. + Analyze production data to identify root causes of process variation and drive corrective actions. * **Equipment \& Tooling** * + Specify and validate production equipment and tooling for SMT and packaging lines. + Work with equipment suppliers to develop process parameters and acceptance criteria. + Support line ramp\-up and maintenance of stable operations. * **D****ocumentation \& Standards** * + Generate and maintain process documentation including work instructions, control plans, and PFMEAs. + Support the implementation of Lean Manufacturing and continuous improvement methodologies. * **Cross\-Functional Collaboration** * + Partner with Quality, Supply Chain, and Product Engineering to resolve technical issues and meet production targets. + Interface with external partners and subcontractors for process transfer or outsourcing activities. Qualifications, Skills and Attributes: **Core Requirements*** Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, or a related field. **Desireable Skills and Experience*** 3\+ years of experience in **semiconductor assembly, optoelectronic packaging**, or **SMT manufacturing** environments. * Proven experience in **new product introduction (NPI)** and **process qualification** (IQ/OQ/PQ). * Familiarity with **cleanroom operations**, **microscale assembly**, and **reliability testing** is preferred. **Technical Skills:*** Knowledge of SMT processes (solder paste printing, placement, reflow) and optical component packaging. * Experience with process simulation, statistical analysis (Minitab, JMP), and design of experiments (DOE). * Understanding of industry standards such as **JEDEC**, **IPC**, and **MIL\-STD** for electronics packaging **Soft Skills*** Strong problem\-solving, analytical, and documentation skills. * Excellent communication and cross\-functional teamwork abilities. * Ability to manage multiple projects in a fast\-paced, technical environment. **Solving Technology Challenges for a Sustainable World** We want the very best people in our TT family across the globe – so we welcome applications from everyone, to celebrate a diverse mix of experiences, backgrounds and identities. We are committed to equality of opportunity for all and you can rest assured that TT Electronics takes positive steps to ensure we are an inclusive business, that will welcome and support you, from your initial application to wherever your career takes you! Please get in touch if you’d like to discuss any reasonable adjustments to your application, in order that we can accommodate and support you in the process. If you want to work for a company where *who* you are is valued and respected, we’d love to hear from you.*\#WeAreTT \#BeMeAtTT* :