Summary: Seeking a highly skilled engineer to develop 2.5D/3D chiplet and networking solutions for heterogeneous compute, driving innovation in SoC and platform architectures. Highlights: 1. Develop cutting-edge 2.5D/3D chiplet and networking solutions 2. Influence next-generation SoC and platform architectures 3. Drive innovation in AI and compute use cases We are seeking a highly skilled engineer to develop 2\.5D/3D chiplet and networking solution based on technology\-systems co\-optimized for a unique era of heterogeneous compute as Moore’s law slows down. The candidate is expected to be an expert in recent technology\-architecture trends for heterogeneous low power high performance compute and AI compute. He/she should be able to apply that knowledge to influence the company's’s next generation SoC and platform architectures, including partitions for logic and Cache, DRAM memories, and involving 2\.5D/3D chiplets and networking technologies to connect them. Knowledge of emerging optical networking technology is a plus. Candidate will also drive innovation in the group and across the company's’s product BUs to effectively map emerging AI and other compute use cases to process and chip\-integration solutions with detailed knowledge of process technology, 2\.5D/3D chiplet architecture, networking technologies, and trade\-offs. Knowledge of different IPs (e.g., CPU, GPU, NPU) and how they act together to drive an E2E use case is a plus. Candidate will work with internal architecture and system teams to develop 2\.5D/3D partitions and map to 3D stacking topologies. Candidate will perform system KPI analysis to drive 3D architecture and stacking strategies for new product introduction. **Minimum Qualifications:** * Experience with 2\.5D and 3D STCO and pathfinding. * Excellent understanding of generic and AI use case KPI dependency on process and system architecture involving 2\.5D/3D chiplets and networking technologies. * Good knowledge of heterogeneous architecture, 2\.5D/3D integration schemes. * Basic programming skills e.g., ability to model (e.g., in Python or other languages), system use case impact of 3D architectures, and integration schemes. * Master's or PhD in Electrical Engineering, Computer Science, or a related field. * Ability to work across teams and BUs. * Ability to work without supervision and as part of a team. * Most tasks do not have defined steps; simultaneous use of multiple mental abilities is generally required to determine the best approach. * Advanced data analysis and interpretation skills are required. **Education:** * Bachelor’s degree in science, Engineering, or related field and 5\+ years of relevant heterogeneous System and technology or related work experience. * OR Master's degree in Science, Engineering, or related field and 4\+ years of heterogeneous System and technology or related work experience. * OR PhD in Science, Engineering, or related field and 3\+ years of heterogeneous System and technology or related work experience. Job Type: Full\-time Pay: $1,000\.00 \- $1,001\.00 per day Work Location: In person