Summary: Lead Digital Design Engineer designing embedded systems for aerospace applications, mentoring engineers, and driving innovation in avionics hardware. Highlights: 1. Lead cutting-edge embedded systems design for aerospace applications. 2. Mentor and collaborate on advanced board-level circuit design. 3. Influence the future of aerospace technology and drive solutions. **Job Description Summary** =========================== As a Lead Digital Design Engineer, you will be at the forefront of designing cutting\-edge embedded systems for aerospace applications, adhering to DO\-254 standards for New Product Introductions (NPIs) and Product Refreshes. Your expertise will shape avionics hardware architectures and support new bids and proposals. In this dynamic role, you will mentor and collaborate with lead design engineers on board\-level circuit design, integration, verification, and documentation of state\-of\-the\-art aerospace processors and FPGA assemblies. This position combines leadership with hands\-on technical work, requiring you to contribute at every stage of the design cycle. You will operate within defined parameters to make critical decisions, apply innovative concepts to complex challenges, and drive solutions through immediate action or short\-term planning. Join us to influence the future of aerospace technology and take your career to new heights!**Job Description** =================== **Responsibilities** * Understand complex avionics systems, integrating both digital and analog components. * Support activities for new bids and proposals, contributing to our growth and innovation. * Stay ahead of technology trends and advancements in embedded systems and electronic components. * Design processor and FPGA assemblies, including schematic capture, component placement, layout constraints, PWB stack\-up, and layout review/approval. * Conduct board bring\-up, integration, and verification activities to ensure robust performance. * Troubleshoot complex issues involving processors, FPGAs, memory components and other components. * Apply Design for Manufacturing (DFM), Maintainability, and Testability principles to enhance product quality. * Participate in architectural trade studies and proposal development to drive strategic decisions. * Interface with internal customers independently, providing expert guidance and support. * Mentor junior engineers, fostering their growth and development. * Lead and coordinate multi\-disciplinary design teams, ensuring cohesive and effective collaboration. * Propose and implement improvements in internal processes to drive efficiency and innovation. **Required Qualifications** * Bachelor’s degree in Electrical Engineering or related field. * Proven experience in board\-level digital design, including schematic design, implementation, integration, and verification. * Expertise in designing high\-speed interfaces. * Proficiency in Board Level Timing Analysis, Stress and Derate Analysis, * Signal Integrity \& Power Integrity. * Strong problem\-solving skills with the ability to break down complex issues and apply critical thinking. * Exceptional technical writing and communication skills. * Experience mentoring and sharing expertise with junior engineers. **Desired Characteristics** * Master’s degree in Electrical Engineering with 7\+ years of professional experience in digital design. * Proven track record of understanding the architecture of complex digital hardware systems. * In\-depth knowledge of the board\-level digital design process, from schematic capture to implementation, integration, and verification. * Expertise in laying out complex Printed Wiring Boards (PWBs). * Experience designing with high\-speed components such as Gigahertz microprocessors, FPGA, CPLD, DDR3 or DDR4 memory, flash memory, Gigabit Ethernet, and PCIe. * Proficiency in working with large pin count devices, featuring 1000\+ pins with 0\.8mm device pitch or smaller. * Skilled in High Density Interconnect (HDI) technologies, including micro vias, buried/blind vias, and back drilling for IPC Class 3 boards. * Experience in designing high\-speed serial links of 5\+ Gbps, such as 10GBASE\-KR, PCIe Gen3, and Fiber Optics. * Familiarity with communication protocols like CAN, MIL\-STD\-1553, ARINC 429, ARINC 664, and TSN. * Knowledge of OpenVPX and PICMG standards. * Experience in the Military, Aerospace, or Avionics sectors. * Proficient with Mentor Graphics Expedition Enterprise and HyperLynx PI/SI tools. * Familiarity with OrCAD PSPICE or LT Spice, Mathcad, Microsoft Office, and Microsoft Visio. * Strong technical writing and communication skills. **Additional Information** ========================== **Relocation Assistance Provided:** No